Housings for power semiconductors :: Alumina Systems s.r.o.

Ceramic to metal sealing is a complex process requiring specialist equipment and knowledge of ceramic metallisation, ceramic manufacturing, brazing, plating and testing. We seal products up to 250 mm in diameter and 100 mm in height. We provide our customers with innovative approach and engineering expertise with the main focus on developing cost effective solutions.

Housings for power semiconductors

Extra thin ceramic housings for welding diodes

Specifications Technical Flatness of copper surface：≤0.005mm Parallelism between copper surfaces：≤0.03mm Concentricity between flange and copper：≤0.5mm Leak rate：≤1×10-8...

Ceramic housings for diode

Specifications Technical Flatness of copper surface：≤0.005mm Parallelism between copper surfaces：≤0.03mm Concentricity between flange and copper：≤0.5mm Leak rate：≤1×10-8 mbarl/s Pull...

Ceramic housings for thyristor

Specifications Technical Flatness of copper surface：≤0.005mm Parallelism between copper surfaces：≤0.03mm Concentricity between flange and copper：≤0.5mm Leak rate：≤1×10-8 mbarl/s Pull...

Ceramic housings for GTO

GTOs are optimized for low conduction losses. Specifications Technical Flatness of copper...