
Ceramic to metal sealing is a complex process requiring specialist equipment and knowledge of ceramic metallisation, ceramic manufacturing, brazing, plating and testing. We seal products up to 250 mm in diameter and 100 mm in height. We provide our customers with innovative approach and engineering expertise with the main focus on developing cost effective solutions.
Housings for power semiconductors
Specifications
Technical
Flatness of copper surface:≤0.005mm
Parallelism between copper surfaces:≤0.03mm
Concentricity between flange and copper:≤0.5mm
Leak rate:≤1×10-8...
Specifications
Technical
Flatness of copper surface:≤0.005mm
Parallelism between copper surfaces:≤0.03mm
Concentricity between flange and copper:≤0.5mm
Leak rate:≤1×10-8 mbarl/s
Pull...
Specifications
Technical
Flatness of copper surface:≤0.005mm
Parallelism between copper surfaces:≤0.03mm
Concentricity between flange and copper:≤0.5mm
Leak rate:≤1×10-8 mbarl/s
Pull...
GTOs are optimized for low conduction losses.
Specifications
Technical
Flatness of copper...
Contact
Alumina Systems s.r.o.
Kladská 916/65
Hradec Králové
50003
CZECH REPUBLIC +420 495 407 549 mrufert@alumina-systems.com
Hradec Králové
50003
CZECH REPUBLIC +420 495 407 549 mrufert@alumina-systems.com